CAPABILITIES
 

      PCBA Capabilities include:
 

• Tin-lead and lead-free SMT, Auto Insertion and Auto Glue Dispensing operations

• Water Soluble, No-Clean and RMA processes

• Wave Solder, Selective Soldering, Solder Fountain and Manual Soldering operations

• SMD placement capabilities: Ultra fine pitch, QFP, BGA, micro BGA, CBGA, CSP & FC to 0.4mm pitch (Discretes down to 0201s)

• Special Rework and Repairs: PWB repairs, BGA and fine pitch rework and reballing as per IPC7711/IPC7721 specs

• IPC Class I, II and III assemblies

• Functional Test (FT), In-Circuit Test (ICT) and Boundary Scan (JTAG, Corel)

• Parts prep, sequencing and press fit connectors

• Box Build Assembly and Full Integrtion

• Conformal Coating, potting and encapsulation